Message from Directors 

Dear Readers,

One thing we have learned from the pandemic is that communications infrastructure needs to be upgraded. 5G is exceedingly important."  These are the words of Mike Noonan, CEO of MixComm, in his recent interview with eeNews which is provided in this week's newsletter below.  SOI platforms are the foundation for many of the technical solutions addressing communications technologies. In this issue, we also highlight AI platforms and photonics, which together with RF technologies are part of the building blocks for our interconnected world.

We take this opportunity to stress the importance of the SOI Newsletter as a communication instrument to underline the dynamic nature of the SOI ecosystem. Please send your contributions or suggestions to or

Enjoy the reading and Stay safe

Best Regards,
Carlos Mazure, Chairman & Executive Director
Jon Cheek, Executive Director

Product Launch of Perf-V Beetle AI Edge Computing Development Board Kit

Perf-V Beetle is a compact development board that employs Greenwave's GAP8 series chips. This FD-SOI based GAP8 development board from PerfX is great for audio and camera-based tinyml edge AI development. Perf-V Beetle development board leads out all necessary I/O, which is convenient for developers to expand applications.

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CEO Interview: The Joy of RFSOI with MixComm's Mike Noonen by Peter Clarke

Lightning-quick to see the sales angle Noonen replied: "One thing we have learned from the pandemic is that communications infrastructure needs to be upgraded. 5G is exceedingly important." And that's what MixComm is betting on with its application of circuit design to a radio frequency silicon-on-insulator (RFSOI) manufacturing process.

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Micrometer-scale InP Selectively Grown on SOI for Fully Integrated Si-photonics

Efficient light interfacing between the III–V lasers on top of the thick buffer and the Si waveguides underneath remains a challenge and is yet to be resolved. As an alternative, selective growth of III–V materials on pre-patterned Si/SOI substrates avoids the thick buffers and confines the crystalline defects induced by lattice mismatch at the III–V/Si hetero-interface.

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Performance-Aware Predictive-Model-Based On-Chip Body-Bias Regulation Strategy for an ULP Multi-Core Cluster in 28nm UTBB FD-SOI

Supporting an extended range of reverse and forward body-bias, UTBB FD-SOI technology provides a powerful knob to compensate for such variations. This research paper propose a methodology to maximize energy efficiency at run-time exploiting body biasing on a ULP platform operating near-threshold.

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China to Push for Foundry Process Advancements

The country's foundry sector has advanced its manufacturing process technology to 14nm and will be capable of fabricating chips using a newer 12nm process technology this year. The transition to more-advanced 7nm process, as well as specialty technology namely FD-SOI, will be the next target during China's next five-year plan.

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Nanolayered Black Arsenic-Silicon Lateral Heterojunction Photodetector for Visible to Mid-Infrared Wavelengths

This photodetector is fabricated using the mechanical exfoliation of bAs on the silicon-on-insulator (SOI) substrate. It shows high photoresponsivities, in the visible to mid-infrared (405 nm to 4 µm) region, which stems from the high absorptivity of bAs and good optical coupling capability of SOI substrate

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IP SoC China 20 September 15th, 2020 A virtual Event
Date & Time: 15 September 2020 (8:00 GMT+8)

China is the largest and fastest-growing semiconductor market in the world and at the same time, the semiconductor world has to face a worldwide fast evolution, never seen before, in terms of new applications (IoT, Artificial Intelligence, Automotive, etc.)
Listen to the Gurus and best experts in the IP SoC arena, such as MIPI PHY in FDSOI Technology, Mixel, Inc., and more.

Register Here

Photonics Asia Digital Forum
Date & Time: 12 October 2020 - 16 October 2020

The event showcases the latest research in biomedical optics, advanced optical imaging, quantum and nonlinear optics, laser processing, plasmonics, holography, and more. Join Optoelectronic Devices and Integration IX’s Session 4 and 5 to learn about “Low-loss large-bandwidth fiber-chip edge couplers on a SOI platform” and “Fast thermo-optic MZI switch using direct current flow through waveguide in SOI”.

Register Here
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