The last few months in the SOI ecosystem have been especially busy. Here are some of the top SOI-related press releases.
Silicon Photonics: A Marriage of Optical and Digital on GF’s RF Process
- GF's Foundry Files blog, 7 May 2020. GF and Ayar Labs collaborated on ways to optimize GF’s 45 RF SOI process for the optical structures and other functions. That technology, developed for the mmWave market, was modified to include photonic function and is now being used to build prototypes. RF SOI CMOS is an “enabling thing, because it allows us to build both transistors and optical devices in the same planar layer. And the SOI process enables extremely fast transistors, faster than most of the advanced nodes built today."
Dolphin Design Unveiling innovative Energy Efficient Platforms, complete turnkey solutions for competitive SoC designs – Dolphin Design announcement, 4 May 2020. The company is releasing four platforms in the coming weeks: SPEED Power Management, SPEED Processing MCU, SPEED ML/AI Processing and/or SPEED Audio.
Silicon Catalyst Collaborates with Arm to Accelerate Semiconductor Startups – Silicon Catalyst press release, 29 April 2020. Arm joins as Strategic Partner and as In-Kind Partner – the first company to join the incubator in both roles. The partnership provides startups with no-cost access to a broad range of Arm® IP, tools and support.
Mixel’s MIPI D-PHY IP Integrated into the Lattice CrossLink-NX FPGA – World’s first low-power FPGA to support D-PHY v1.2 with 2.5Gbps/lane. Mixel press release, 28 April 2020. The new CrossLink-NX FPGAs are built on Samsung’s 28nm FD-SOI technology.
GlobalFoundries Dresden Certified to Manufacture Secure Products - GF Press release, 27 April 2020. The official BSI certification extends the ability to cost effectively manufacture secure, connected products to GlobalFoundries’ 22FDX (FD-SOI) technology.
GlobalFoundries Qualifies Synopsys’ IC Validator for Signoff Verification on 22FDX Platform – Synopsys press release, 16 April 2020. With IC Validator physical verification, customers striving to take advantage of the low-power and performance benefits of GF's FD-SOI technology can now quickly verify that their designs meet signoff requirements for manufacturability compliance and maximum yield. Signoff design rule check (DRC), design for manufacturability (DFM), layout vs schematic (LVS) and metal fill runsets and tech files are available today from GF.
Compact Model Developed at CEA-Leti for FD-SOI Technologies Designated as a Chip-Industry Standard – Leti press release, 2 April 2020. This is of paramount importance for large chipmakers and positions CEA-Leti among the few compact-model developer teams able to develop and support a Standard Model. The Si2 Compact Model Coalition announcement covers the approval and financial support of L-UTSOI. (SOI News coverage here.)
Lattice Semiconductor Joins Silicon Catalyst In-Kind Partner Ecosystem to Foster Broader Use of FPGAs – Silicon Catalyst press release, 2 April 2020.
Perceive Corporation Launches to Deliver Data Center-Class Accuracy and Performance at Ultra-Low Power for Consumer Devices – Perceive press release, 31 March 2020. Introduces breakthrough Ergo™️ edge inference processor, delivering 4+ TOPS sustained and 55 TOPS/W, capable of processing large neural networks in 20mW. The company has partnered with GlobalFoundries to manufacture the Ergo chip on their 22FDX® platform.
Photonic Solutions From Synopsys Support Advancements in Nanoscale Optics – Synopsys press release, 30 March 2020. This latest Photonic Solutions Portfolio accelerates design of AR/VR Systems, Optical Communications, and PICs. Additional details were given by Synopsys during the SOI Consortium’s Japan Symposium.
QuickLogic’s eFPGA Qualified on GLOBALFOUNDRIES 22FDX® Platform for IoT and Edge AI Applications – QuickLogic press release, 11 March 2020.
Soitec’s engineered substrates for 5G – Soitec press release, 4 March 2020. A new presentation available on the company’s website highlights Soitec’s portfolio of engineered substrates for 5G markets and applications.
X-FAB’s Automotive 180nm BCD-on-SOI Technology Platform Further Optimized for Smart Actuators and Power Management - X-Fab press release, 20 February 2020.